Biography

Jiancheng An received the B.Eng. and Ph.D. degrees from University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2016 and 2021, respectively. He was a Visiting Scholar with Next Generation Wireless Research Group, Southampton University, Southampton, UK, in 2020. From 2022 to 2023, he was a Post-Doctoral Fellow with the Engineering Product Development Pillar (EPD), Singapore University of Technology and Design (SUTD), Singapore. Since 2023, he has been with the School of Electrical and Electronic Engineering, Nanyang Technological University (NTU), Singapore.

Dr. An received IEEE International Conference on Communications (ICC) 2023 Best Paper Award. He has 6 patents and published over 100 research papers at international journals or conferences.

Education

• 2016.09 - 2021.12: Ph.D
  • University of Electronic Science and Technology of China (UESTC)
• 2012.09 - 2016.06: B.S.
  • University of Electronic Science and Technology of China (UESTC)
    
    
    

Experience

• 2023.10 - Present: Research Fellow
  • Nanyang Technological University (NTU)
  • School of Electrical and Electronic Engineering
  • Supervisor: Prof. Chau Yuen
• 2022.10 - 2023.10: Research Fellow
  • Singapore University of Technology and Design (SUTD)
  • Engineering Product Development Pillar (EPD)
  • Supervisor: Prof. Chau Yuen
• 2019.10 - 2020.10: Visiting Scholar
  • Southampton University
  • Next Generation Wireless Research Group
  • Supervisor: Prof. Lajos Hanzo
    
    
    

Research Interests

• Stacked Intelligent Metasurfaces (SIM)
• Flexible Intelligent Metasurfaces (FIM)
• Near-Field Communications (NFC)
• Holographic MIMO Communications
• Reconfigurable Intelligent Surface (RIS)
• Integrated Sensing and Communications (ISAC)
• Unmanned Aerial Vehicle (UAV)
• Artificial Intelligence (AI)
  
  
  

Award

• 2025 One of the Top 2% of scientists worldwide (Stanford University/Elsevier)
• 2023 IEEE ICC Best Paper Award