Biography
Jiancheng An (Senior Member, IEEE) received the B.S. degree in Electronics and Information Engineering and the Ph.D. degree in Information and Communication Engineering from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2016 and 2021, respectively.
From 2019 to 2020, he was a Visiting Scholar with the Next-Generation Wireless Group, University of Southampton, Southampton, U.K. From 2021 to 2023, he was a Post-Doctoral Research Fellow with the Engineering Product Development (EPD) Pillar, Singapore University of Technology and Design (SUTD), Singapore. From 2023 to 2026, he was a Research Fellow with the School of Electrical and Electronics Engineering, Nanyang Technological University (NTU), Singapore. He is currently a Professor with the School of Electronic Science and Engineering, UESTC, Chengdu, China.
Dr. An received the IEEE International Conference on Communications (ICC) 2023 Best Paper Award. He is the co-inventor of six patents and has published over 100 research papers in peer-reviewed international journals and conferences. His research interests include stacked intelligent metasurfaces (SIM), flexible intelligent metasurfaces (FIM), and electromagnetic neural networks (EMNN).
Dr. An serves as an Editor for IEEE Transactions on Communications, IEEE Open Journal of the Communications Society, and IEEE Wireless Communications Letters. He is also the Lead Guest Editor for the Special Issue on “Stacked Intelligent Metasurface-Empowered Advanced Signal Processing Paradigm for 6G and Beyond” in IEEE Wireless Communications.
Education
- 2016.09 - 2021.12 Ph.D. in Information and Communication Engineering, University of Electronic Science and Technology of China (UESTC)
- 2012.09 - 2016.06 B.S. in Electronics and Information Engineering, University of Electronic Science and Technology of China (UESTC)
Experience
| Time | Position | Institution | Supervisor |
|---|---|---|---|
| 2026.04 - Present | Professor | School of Electronic Science and Engineering, UESTC | Jun Hu |
| 2023.10 - 2026.02 | Research Fellow | School of Electrical and Electronic Engineering, NTU | Chau Yuen |
| 2022.03 - 2023.10 | Professor | Engineering Product Development Pillar (EPD), SUTD | Chau Yuen |
| 2019.10 - 2020.10 | Visiting Scholar | Next Generation Wireless Research Group, Southampton University | Lajos Hanzo |
Research Interests
- Stacked Intelligent Metasurfaces (SIM)
- Flexible Intelligent Metasurfaces (FIM)
- Near-Field Communications (NFC)
- Holographic MIMO Communications
- Reconfigurable Intelligent Surface (RIS)
- Integrated Sensing and Communications (ISAC)
- Unmanned Aerial Vehicle (UAV)
- Artificial Intelligence (AI)
Awards & Honors
- 2025 One of the Top 2% of scientists worldwide (Stanford University/Elsevier)
- 2023 IEEE ICC Best Paper Award
- ESI 14 ESI Highly Cited Papers & 2 ESI Hot Papers